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Revolutionary Liquid Cooling Solutions for High-Powered Electronics.

As electronic devices become more compact and powerful due to global miniaturization trends, conventional air cooling methods are no longer sufficient to maintain optimal performance. Liquid cooling emerges as the most effective and efficient solution for managing high-density heat loads in such advanced devices.

Our cutting-edge liquid cooling solutions leverage the superior specific heat capacity of liquids, enabling them to dissipate significantly more power compared to forced air cooling. This results in enhanced thermal management and improved reliability of the entire system.

We offer versatile liquid cooling solutions that can be integrated at the device, enclosure, or complete system level. Our liquid cold plates are specifically designed for high-powered electronics, IGBT modules, lasers, wind turbines, motor devices, automotive components, medical equipment, and other applications requiring efficient liquid cooling.

Choose our liquid cooling solutions for unmatched efficiency, reliability, and performance in your high-powered electronic applications.

High-Performance Cold Plates for Enhanced Heat Dissipation

Our cold plates are renowned for their reliability in the field and flexibility in manufacturing. Each cold plate is meticulously constructed from two parts: a top cover and a bottom cover, both sealed in a vacuum chamber for superior quality. The internal flow channels feature either skived fins or folded fins, maximizing surface area for optimal heat dissipation. This advanced manufacturing process eliminates the need for flux, ensuring cleaner operation, and offers batch processing that is both controllable and highly repeatable.

These exceptional cold plates are ideal for applications in locomotives, electric vehicles, power generation, and more, making them a preferred choice for high-demand industries.

Efficient and Cost-Effective Friction Stir Welding (FSW) for LCP Manufacturing

Friction stir welding (FSW) is a highly efficient solid-state joining process that uses a non-consumable tool to seamlessly join two workpieces without melting the material. The frictional heat generated between the rotating tool and the base material localizes and connects the adjacent materials. This method of joining the top and bottom covers of liquid-cooled plates (LCPs) is exceptionally cost-effective compared to other processes.

Thanks to the greater thickness, FSW-manufactured LCPs exhibit lower thermal resistance than tube-type alternatives, making them ideal for high-performance applications.

Advanced Cooling Solutions for Diodes

Our cold plates are most commonly used for diode cooling, featuring highly specialized geometry for uniform cooling on both sides. This design ensures consistent performance and efficiency. The inclusion of vortexes enhances the liquid mixture, significantly improving heat transfer across the cold plate without increasing pressure drop. This results in a more efficient heat transfer system overall.

Tubed Cold Plates: Cost-Effective and Reliable Liquid Cooling Solutions

The Tubed Cold Plate family offers a cost-effective and reliable solution within the liquid cold plate category. By placing the cooling tube in direct contact with the device’s bottom plate, this design minimizes thermal resistance, enhancing performance by reducing the number of thermal interfaces between the device and the cooling fluid.

Manufactured using high-quality copper or stainless steel tubes pressed into aluminum plates, these cold plates are designed specifically for low to medium power density applications. The direct contact method ensures superior heat transfer, making these liquid cold plates an ideal choice for efficient cooling solutions.