Home » Our Principals » ShinEtsu-Thermal interface Material

Shin-Estu

In 1953, Shin-Etsu Chemical became Japan’s first silicone manufacturer. Today, the company offers over 5,000 silicone products across various industries, including electronics, automotive, construction, cosmetics, healthcare, and chemicals. With production facilities and sales offices in the USA, South Korea, China, Taiwan, Singapore, Thailand, and the Netherlands, the company has established a global presence. This has made Shin-Etsu Japan’s top silicone manufacturer and a leading global player. For over 70 years, Shin-Etsu Silicone has continuously innovated to enhance its customers’ businesses.

Pantronics India, an authorized distributor of Shin-Etsu, offers a wide range of thermal management products, including Thermal Interface Insulating Silicone Rubber Sheets, Silicone Soft Pads, Phase Change Materials, Liquid Gap Fillers, Liquid Silicone Rubber Adhesives, and Potting Materials.

Silicone Thermal Interface Materials

Today’s electronic devices are getting smaller and more powerful, which makes heat control very important. Too much heat can slow things down, cause errors, or even damage the device. This is where Thermal Interface Materials (TIMs) come into play. These specialized materials bridge the microscopic gaps between heat-generating components and heat sinks or other cooling devices, facilitating efficient heat transfer. Silicone-based TIMs are especially popular because they are reliable, flexible, and work well with both heat and electricity.

What are Thermal Interface Materials?

In simple terms, thermal interface materials are thermally conductive substances used between two surfaces to improve heat transfer. Even the smoothest surfaces have microscopic air pockets, which are not good heat conductors. TIMs occupy these pockets, providing a better path for heat to dissipate away from delicate electronic components.

Types of Silicone Thermal Interface Materials

Sheet Product

The TC Series offers high-hardness thermal interface materials known for their outstanding insulation and efficient heat dissipation. These silicone rubber-based composites are enhanced with specialized fillers, making them ideal for managing thermal performance in electronic components. Their soft, tacky texture ensures a secure seal between heat-generating parts and heatsinks, helping to improve system reliability. Designed for demanding applications, these materials deliver high thermal conductivity while maintaining durability and ease of application.

Main Features

Strong electrical insulation with zero conductivity
Reinforced with Fiberglass or Polyimide film for added strength
UL-certified for flame resistance
Operates in extreme temps: -40°C to +180°C

Typical Applications

Ideal for use in power transistors and power modules, providing effective thermal management and electrical insulation.
Designed for thermal conductivity, insulation, and vibration suppression in semiconductor devices like CPUs and various electronic components.
The TC series functions as efficient heat spreaders and insulators, also delivering excellent thermal conductivity for fuses and temperature sensors.

Structure

Parameter	TC-TA-1 series	TC-TAG-2 series	TC-TAP-2 series	TC-TAG-3 series	TC-TAG-6 series	TC-TAG-8 series	TC-BG series
Color	Black brown	Purple	Light purple	Dark Gray	Pink	Light gray	White
Reinforcement layer	None	Glass cloth	Polyimide film	Glass cloth	Glass cloth	Glass cloth	Glass cloth
Standard size (mm)	300×1,000	300×1,000	320×1,000	300×1,000	420×500	420×500	210×270
Thickness (mm)	0.20, 0.30, 0.45	0.20, 0.30, 0.45, 0.80	0.11	0.20, 0.30, 0.45	0.20, 0.30, 0.45	0.20, 0.30, 0.45	0.20, 0.30, 0.45
Representative product	TC-30TA-1 (0.30 mm)	TC-30TAG-2 (0.30 mm)	TC-11TAP-2 (0.11 mm)	TC-30TAG-3 (0.30 mm)	TC-30TAG-6 (0.30 mm)	TC-30TAG-8 (0.30 mm)	TC-30BG (0.30 mm)
Thermal conductivity of rubber (W/m·K)	1.0	1.8	1.8	3.4	6.0	8.0	7.3
Thermal conductivity of products (W/m·K)	1.1	1.4	2.0	1.7	1.2	1.0	1.0
Thermal resistance 50℃/100 psi (cm²·K/W)	3.8	2.5	2.0	1.7	4.3	6.2	6.5
Density at 23℃ (g/cm³)	1.70	1.86	1.65	2.84	1.90	1.56	1.66
Hardness Durometer A	70	91	87	90	88	83	86
Dielectric breakdown voltage (kV)	15	10	8	9	7	8	15
Dielectric strength (kV)	15	7	7	7	7	7	13
Volume resistivity (TΩ·m)	5.4	3.5	14.0	0.9	6.4	5.4	68.0
Flame retardance UL94	—	—	—	—	V-0 (UL file No. E48923)
Low-molecular weight siloxane content (ppm)	40	30	<10	<10	<10	20	<10

Thermal interface silicone soft pads and ultra-soft pads are made from silicone rubber blended with thermally conductive fillers. Available in single-layer and composite types, they offer high thermal conductivity and flexibility. With excellent softness and surface adhesion, these pads bond tightly between heat-generating components and heatsinks, minimizing air gaps and improving cooling efficiency in electronics, automotive, and industrial systems.

Main Features

Designed to conform closely to uneven or complex surfaces for optimal thermal contact
Easy to apply and remove, making them ideal for temporary or repositionable installations
UL-certified for dependable flame-retardant safety compliance
Offers excellent thermal conductivity with cost-effective performance
Reliable operation across a wide temperature range: -40°C to +180°C.

Typical Applications

Heat dissipation for MPUs of computers, etc.
Heat dissipation for surface packaging microchips which generate high heat.

Structure

Parameter	TC-SP-1.7 Series	TC-CAS-10 Series	TC-CAB-10 Series	TC-CAD-10 Series	TC-CAT-20 Series	TC-CAF-40 Series	TC-PEN3-10 Series	TC-PEN5-20 Series	TC-UP8 Series
Color	Light blue/gray	Dark gray	Pale reddish brown	Pale red purple	Gray	Light purple	Light purple	Blue	Gray
Standard size (mm)	300×400
Thickness (mm)	0.5, 1.0, 1.5, 2.0, 2.5, 3.0, 4.0, 5.0
Representative product	TC-SP-1.7 (1.0 mm)	TC-CAS-10 (1.0 mm)	TC-CAB-10 (1.0 mm)	TC-CAD-10 (1.0 mm)	TC-CAT-20 (1.0 mm)	TC-CAF-40 (1.0 mm)	TC-PEN3-10 (1.0 mm)	TC-PEN5-20 (1.0 mm)	TC-UP8 (1.0 mm)
Thermal conductivity of rubber (W/m·K)	1.5	2.3	3.2	3.0	4.5	5.2	5.2	5.2	8.0
Thermal resistance 50℃/50 psi (cm²·K/W)	4.1	2.6	1.5	1.5	1.4	1.2	2.34	1.27	0.92
Density at 23℃ (g/cm³)	2.00	2.1	2.1	2.1	2.1	2.1	1.6	1.6	2.6
Hardness Asker C	12	20	20	20	25	30	10	12	30
Dielectric breakdown voltage in oil (kV)	6	6	6	6	6	6	6	6	8
Dielectric strength in oil (kV)	6	6	6	6	6	6	6	6	8
Flame retardance UL94	V-0 (UL file No. E48923)						V-0 equivalent
Low-molecular weight siloxane content (ppm)	20	70	90	90	90	90	<10	<10	<10

Thermal Interface Phase Change Materials (PCMs) are advanced thermally conductive sheets that soften and transition phases when exposed to heat, ensuring optimal thermal transfer. These materials now feature enhanced performance parameters, delivering improved efficiency, reliability, and heat dissipation for high-performance electronic applications.

Main Features

Excellent Conformability: Flows and fills surface gaps post phase-change for optimal thermal contact.
High Pump-Out Resistance: Silicone-based for long-term stability under pressure and heat.
Efficient Processing: Easy application enables faster, cleaner manufacturing.

Typical Applications

Heat transfer medium for use with heat-generating devices such as PCs, DVD drives, power supply units, etc.
Heat dissipation for heat-generating electronic components.

Structure

Parameter	Test method	PCS-CR-10	PCS-LT-30	PCS-PL-30
Thermal conductivity (W/m·K)	ASTM E1461	2.0	3.0	1.7^*3
Thermal resistance (cm²·K/W)	ASTM E1461	0.08	0.11	0.73
Type	-	Non-insulated	Non-insulated	Insulator
Color	-	White	Gray	White
Initial thickness (µm)	-	200	120	120
Thickness after compression (µm)	Microgauge	10	28	30
Reinforcement layer	-	None	None	Polyimide film
Density at 23℃ (g/cm³)	JIS K 6249	2.9	2.4	2.7
Dielectric breakdown voltage (kV)	JIS K 6249	6	6	5.5^*4
Softening point (℃)	Shin-Etsu method	About 50	About 50	About 50
Standard size	-	300×400, Roll	300×400, Roll	320×400, Roll
Flame resistance UL94	-	V-0 equivalent	V-0 equivalent	V-0 equivalent

High-Performance Thermal Interface Tape – Now in 100µm & 200µm Thickness Options
Introducing our advanced thermal interface tape, designed as a single-layer, double-sided adhesive solution for efficient heat transfer. The new product lineup now features 100µm and 200µm thicknesses, offering enhanced thermal conductivity, strong adhesion, and superior reliability for electronic and industrial applications.

Main Features

Strong adhesive holds parts firmly without screws.
Maintains stable thermal resistance in all temperatures.
Easy to apply over large areas with automated equipment.

Typical Applications

Heat dissipation for power transistors
Heat dissipation for substrates

Structure

Parameter	Test method	TC-10SAS	TC-20SAS
Thermal conductivity (W/m·K)	ASTM E1461^*3	1.0	1.0
Thermal resistance (cm²·K/W)	ASTM E1461^*3	2.0	2.9
Color	—	White	White
Standard size (mm)	—	300×400	300×400
Thickness (µm)	—	100	200
Dielectric breakdown voltage (kV)	JIS K 6249	6	6
Peeling strength^*2 (Aluminum)	—	6.0	6.4
Peeling strength^*2 (SUS)	—	7.3	8.1
Peeling strength^*2 (Glass epoxy)	—	7.6	8.1
Flame resistance UL94	—	V-0 (UL file No. E48923)

Liquid and Grease Products

Thermally conductive oil compounds are high-performance, grease-like materials made from silicone fluid and thermally conductive fillers like alumina powder. Designed for efficient heat transfer and electrical insulation, they deliver exceptional thermal stability and resist oxidation. Ideal for applications across a wide temperature range, these compounds ensure long-lasting reliability in electronic and industrial thermal management systems.

Main Features

Excellent thermal conductivity for effective heat dissipation
Screen-printable grease-like consistency for easy application
Maintains performance in extreme temperatures due to superior heat and cold resistance
High dropping point ensures durability under thermal stress
Low oil separation and minimal volatility for reliable long-term use
Outstanding thermal oxidation stability
Resists consistency changes, ensuring uniform performance
Remains fluid with no solidification below 0°C

Typical Applications

Ideal for thermal management in semiconductors (power transistors, ICs, CPUs).
Suitable for resin-encapsulated power transistors.
Excellent for potting between heatsinks and components like transistors, rectifiers, and thyristors.
Used for sealing sensor elements (thermistors, thermocouples)
Effective in potting heat-generating parts such as heaters and heat dissipaters

Structure

Parameter\ Product Name	G-747	G-775	G-777	G-779	Condensation Cure Type G-1000
Appearance	White grease
Thermal conductivity (W/m·K)	0.9	3.6	3.3	3.0	2.4
Thermal resistance (mm²·K/W)	15	25	21	10	29
BLT (µm)	10	75	56	25	50
Specific gravity at 25℃	2.65	3.4	3.2	3.2	3.04
Viscosity at 25℃ (Pa·s)	50	500	160	160	80
Penetration 25℃ / Unworked	328^*3	250	190	190	240
Hardness after curing (Asker C)	-	-	-	-	40
Dielectric breakdown strength 0.25 mm (kV)	3.7	2.5	3.2	3.2	3.6
Use temperature range (℃)	-50 ~ +150	-40 ~ +150	-40 ~ +200	-40 ~ +200	-40 ~ +180
Low-molecular weight siloxane content ΣD3~D10 (ppm)	<100	<300	<100	<100	<100

Adhesive Thermal Interface Material is a high-performance compound that combines strong adhesion with efficient heat transfer. It fills air gaps between components and heatsinks, ensuring reliable thermal conductivity while securely bonding surfaces in electronic and industrial applications.

Main Features

Available in paste, medium, and low-viscosity liquid forms.
Cures by moisture or heat into rubber-like elastics.
Dual-purpose: provides thermal conductivity and strong adhesion.
Suitable for potting and sealing for insulation and moisture protection.
UL94 V-0 certified for flame retardancy

Typical Applications

Heat dissipation in complex-shaped or uneven surfaces.
Bonding and fixing of heating elements.
Used where thermal sheets cannot be applied.
Effective in radiating heat and sealing components simultaneously

Structure

Parameter\ Product Name	KE-4918-WF	KE-4961-W	KE-4962-W	KE-1867	KE-1891
Thermal conductivity (W/m·K)	0.85	1.6	2.4	2.2	4.0
Curing method	One-component condensation			One-component addition
Before curing
Appearance	White paste	White paste	White paste	Gray medium viscosity liquid	Grayish white paste
Byproduct gas	Alcohol	Alcohol	Alcohol	NA	NA
Viscosity at 23°C (Pa·s)	-	-	-	70	NA
Tack-free time (min)	3	1	2	NA	NA
Standard curing conditions	23°C ± 2°C / 50 ± 5% RH × 7 days			120°C × 1h
After curing
Density at 23°C (g/cm³)	1.68	2.34	2.65	2.92	3.06
Hardness durometer A	80	80	86	75	96
Tensile strength (MPa)	3.5	3.9	4.4	3.6	4.8
Elongation at break (%)	60	30	40	60	30
Volume resistivity (TΩ·m)	4.5	4.0	1.0	1.2	1.0
Dielectric breakdown strength (kV/mm)	27	24	25	25	25
Tensile lap-shear strength (Al/Al) MPa	1.0 (Cu/Cu)	0.7	0.8	0.8	0.8
Low-molecular weight siloxane content ΣD₃~D₁₀ (ppm)	<300	<300	<300	<300	<300
Flame resistance (UL94)	V-0	V-0	V-0	V-0	V-0

Potting materials are specialized compounds used to encapsulate electronic components, providing protection against moisture, dust, vibration, and thermal stress. These materials enhance electrical insulation, mechanical stability, and extend the operational life of devices. Commonly used in power supplies, automotive electronics, and industrial equipment, potting ensures long-term reliability even in harsh environments

Main Features

Excellent insulation for electrical safety and performance.
Moisture and environmental protection to prevent corrosion and failure.
Thermal stability to withstand high and low temperature cycles.
Vibration and shock resistance for enhanced mechanical durability.
Chemical resistance to oils, solvents, and contaminants.
Customizable viscosity and cure types (room temperature, heat cure, UV cure).
Compatible with a wide range of substrates, including metals, plastics, and PCBs.

Typical Applications

Power supplies & circuit boards
Automotive ECUs & sensors
LED lighting & drivers
Industrial control units
Consumer and telecom electronics

Parameter & Product Name	KE-1292-A/B	KE-1285-A/B	KE-1897-A/B	KE-1898-A/B	KE-1899-A/B
Thermal conductivity (W/m·K)	0.55	0.8	1.6	2.2	3.0
Curing method	Two-component, addition
Appearance	A: Black B: Grayish white	A: Gray B: Grayish white	A: Gray B: White	A: Gray B: White	A: Gray B: White
Viscosity at 23℃ (Pa·s)	A: 5 B: 2	A: 5 B: 5	A: 11 B: 7	A: 22 B: 14	A: 21 B: 12
Pot life (min)	48h	900	1,440h	7,000	48h
Standard curing conditions	80℃×2h	120℃×1h	120℃×1h	120℃×1h	120℃×1h
Density at 23℃ (g/cm³)	1.48	1.72	2.61	2.86	3.00
Hardness durometer A	37	56	20	22	52^*2
Tensile strength (MPa)	1.8	2.0	0.4	0.4	0.7
Elongation at break (%)	140	60	100	60	50
Volume resistivity (TΩ·m)	2.5	0.6	6.0	3.0	4.0
Dielectric breakdown strength (kV/mm)	30	26	25	19	18
Tensile lap-shear strength (MPa) (Al/Al)	0.6 (Glass epoxy)	—	0.2	0.2	0.2
Low-molecular weight siloxane (ppm)	<300	<500	<500	—	—
Flame resistance (UL94)	V-0	V-0	V-0	V-0	—

SDP Series: Two-Component Room Temperature Addition Cure Type

Main Features

Compatible with various heating element shapes and configurations
SDP Series (two-component, room temperature addition cure):
Forms a soft, stress-absorbing sheet at room temperature; cure time can be accelerated with heat
CLG Series (one-component, uncured type):
Thick application capability with excellent pump-out and misalignment resistance

Typical Applications

Ideal for thermal management in large gap areas where thick coating is needed
Perfect for stress-relief zones using materials with cushioning properties
Effective for uneven surfaces due to high compliance
Best suited for applications requiring reworkability and flexibility

Parameter & Product Name	SDP-3540-A/B	SDP-5040-A/B	SDP-6560-A/B
Thermal conductivity (W/m·K)	3.5	5.1	6.5
Curing method	Two-component, addition
Standard curing conditions	25°C × 24h
Appearance	A: White B: Gray (Grease)	A: Grayish white B: Pink (Grease)	A: Grayish white B: Pink (Grease)
Viscosity at 23°C (Pa·s)	A:103 B:72*	A:181 B:162*	A:282 B:288*
Mix ratio	100:100
Mixed viscosity at 25°C (Pa·s)	89*	169*	284*
Touch drying time (min)	360	360	360
Pot life at 23°C (min)	240	240	240
Specific gravity at 25°C	A:3.08 / B:3.07	A:3.25 / B:3.26	A / B: 3.20
Density at 23°C (g/cm³)	3.09	3.27	3.34
Hardness (Shore OO / Asker C)	44 / 17	42 / 16	61 / 30
Tensile strength (MPa)	0.1	0.1	0.1
Elongation at break (%)	40	30	20
Volume resistivity (TΩ·m)	0.018	0.031	0.028
Dielectric breakdown strength (kV/mm)	20	21	20
Low-molecular weight siloxane content ΣD₃~D₁₀ (ppm)	<300	<300	<300
Flame resistance (UL94)	V-0 equivalent	V-0 equivalent	V-0 equivalent

CLG Series: One- Component Non-cured Type Products with Improved Pumpout and Misalignment Resistance

Parameter & Product Name	CLG-2500	CLG-3500	CLG-4500
Thermal conductivity (W/m·K)	2.9	3.5	4.8
Appearance	White grease
Specific gravity at 25℃	2.9	3.1	3.2
Viscosity at 25℃ (Pa·s)	500	250	550
Dielectric breakdown strength (kV/mm)	6.2	8.9	4.7
Use temperature limit (℃)	-40 ~ +180
Low-molecular weight siloxane ΣD₃~D₁₀ (ppm)	<300

Pantronics India is the authorized distributor of Shin-Etsu, Japan’s No.1 silicone material brand, offering advanced thermal interface materials (TIMs) for effective heat management. With over 70 years of expertise and 2,500+ patents, Shin-Etsu leads in high-performance solutions like Thermal Interface Silicone Sheets, Soft Pads, Phase Change Materials, Gap Fillers, Silicone Adhesives, and Potting Compounds.

Trusted by industries worldwide, Pantronics India provides Shin-Etsu’s reliable, durable, and efficient TIMs to meet today’s demanding electronic applications. Count on us for genuine, high-quality thermal solutions that ensure your devices run cooler and safer.