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Thermal Interface Gap Fillers — SDP & Pre-Cured Gel Series

The highest-performance thermal gap filler India range — Shin-Etsu SDP and CLG series. Two formats: SDP two-component cure-in-place (3.5–9.5 W/m·K) and CLG pre-cured gel (1.5–4.8 W/m·K). Both bridge large, uneven gaps with pumpout resistance across 1,000 thermal cycles in EV battery packs and 5G base stations.

3.5–9.5

W/m·K (SDP Series)

1.5–4.8

W/m·K (CLG / G-800)

9.5 W/m·K

SDP-9550 — highest in range

240 min

Overview

What Are Thermal Interface Gap Fillers?

Thermal interface gap fillers bridge large, uneven or variable gaps between heat sources and heatsinks or cooling plates — clearances too large or irregular for sheets, pads or grease to handle effectively. Applied thickly, they conform fully to mating surfaces while their soft, cushioned structure relieves mechanical stress and absorbs vibration.

The SDP Series (SDP-3560-A/B through SDP-9550-A/B) is a two-component, room-temperature addition-cure compound. Before curing, it is a white grease-like compound that wets the substrate well; after curing at 25°C × 24 h (accelerated by heat), it becomes a soft sheet. SDP-9550-A/B at 9.5 W/m·K is the single highest-conductivity product in the entire Shin-Etsu TIM range.

The CLG Pre-Cured Gel Series (CLG-1500 to CLG-4500) and G-800 are one-component, ready-to-dispense materials that require no mixing or curing — dispensed directly onto the substrate, they maintain their gel-like consistency and provide exceptional pumpout resistance verified to 1,000 thermal cycles (−40°C ↔ +125°C).

SDP Series: two-component, RT addition cure, 240 min pot life, heat-acceleratable
SDP-9550-A/B: 9.5 W/m·K — highest conductivity in the entire Shin-Etsu TIM lineup
CLG / G-800: one-component, no mixing, no cure time — dispense and assemble
Pre-cured gel: pumpout resistance tested to 1,000 cycles, −40°C ↔ +125°C (30 min each)
Non-adhesive — reworkable and serviceable; provides no bonding force
Thick application possible — can fill gaps of 1–10 mm or more

Application Scenes

Where Silicone Soft Pads Are Used

EV Battery Pack Thermal Management

SDP Series (3.5–9.5 W/m·K) fills the variable clearance between battery cell modules and the cooling plate across large EV battery packs. The 240 min pot life allows time for large-area dispensing and assembly before cure. SDP-9550-A/B provides the maximum conductivity available in any Shin-Etsu TIM.

Automotive ECU Heat Dissipation

CLG pre-cured gel series (CLG-1500 to CLG-4500) is dispensed between automotive ECU components and the aluminium housing. The pre-cured gel eliminates mixing and cure-time wait, and its exceptional pumpout resistance ensures stable thermal performance through the lifetime of the vehicle over thousands of thermal cycles.

5G Base Station & Telecom Modules

G-800 (4.0 W/m·K pre-cured gel) is used in 5G base station RF power amplifier modules and telecom rack electronics where the gap between multi-height power components and the chassis back-wall varies significantly and rework access must be preserved for future field service.

Industrial Power Electronics (Vibration)

SDP Series cure-in-place gap filler is ideal for industrial drives, UPS modules and inverters subject to floor-mounted vibration. The cured soft elastomer absorbs vibrational energy while conducting heat — preventing the pump-out failure mode that eliminates standard greases from vibration-intensive applications.

Datasheet

General Properties — SDP Series (Two-Component RT Addition Cure)

SDP Series — two-component addition cure, 25°C × 24 h (ISO 22007-2, JIS K 6249). All: white grease appearance before cure.

Parameter	SDP-3560-A/B	SDP-5040-A/B	SDP-6560-A/B	SDP-8070-A/B	SDP-9550-A/B
Thermal conductivity (W/m·K)	3.5	5.1	6.5	8.0	9.5
Mix ratio A:B (weight)	100:100
Pot life at 23°C (min)	240
Density after cure (g/cm³)	3.1	3.27	3.34	3.18	3.05
Hardness, Shore OO / Asker C	65 / 35	42 / 16	61 / 30	69 / 42	54 / 24
Tensile strength (MPa)	0.2	0.1	0.1	0.2	0.1
Elongation at break (%)	50	30	20	20	40
Volume resistivity (TΩ·m)	0.015	0.031	0.028	0.016	0.014
Dielectric breakdown (kV/mm)	20	21	20	16	14
Flame resistance UL94	V-0 equiv.	V-0	V-0	V-0 equiv.	V-0 equiv.
LMW siloxane (ppm)	<300	<300	<300	<300	<300

General Properties — CLG / G-800 Pre-Cured Gel Series

CLG / G-800 Series — one-component pre-cured gel (ISO 22007-2). White appearance. Pumpout resistance tested: 1,000 cycles −40°C ↔ +125°C (30 min each).

Parameter	CLG-1500	CLG-2500	CLG-3500	CLG-4500	G-800
Thermal conductivity (W/m·K)	1.5	2.9	3.5	4.8	4.0
Specific gravity at 25°C	2.6	2.9	3.1	3.2	4.0
Viscosity at 25°C (Pa·s)	500	500	250	550	170
Dielectric breakdown (kV/mm)	9.6	6.2	8.9	4.7	3.2
Use temperature (°C)	−40 to +180	—	61 / 30	69 / 42	54 / 24
LMW siloxane (ppm)	<300	<300	<300	<300	<200

Pumpout resistance verification: CLG-1500 through CLG-4500 and G-800 were tested under 1,000 vertical thermal cycles (−40°C ↔ +125°C, 30 min each). All grades showed minimal migration and stable thermal resistance — demonstrating the pumpout resistance that distinguishes pre-cured gel from standard greases in vibration and thermal-cycling environments.

Grade Selector

SDP vs CLG — Which Thermal Gap Filler India Format to Use

Shin-Etsu offers two thermal gap filler India formats for thick-gap, high-power applications. SDP is a two-component cure-in-place system; CLG/G-800 is a pre-cured one-component gel. The right choice depends on conductivity target, dispensing infrastructure and gap geometry.

Parameter	SDP Series (Cure-in-Place)	CLG / G-800 (Pre-Cured Gel)
Format	Two-component liquid; dispense and cure in gap	One-component gel; ready to dispense, no cure step
Thermal conductivity (W/m·K)	3.5–9.5	1.5–4.8
Gap thickness range	0.5–5 mm (flows to fill)	0.5–3 mm (pre-formed gel consistency)
Dispensing equipment	2K meter-mix dispenser with static mixer	Single-barrel dispensing gun or automated syringe
Process throughput	Cure time 30–60 min at 60°C; batch or inline oven	No cure step — immediate assembly after dispense
Pumpout resistance	Excellent — cured elastomer cannot pump out	Very good — high-viscosity gel resists migration
Reworkability	Limited — cut/peel cured layer	Easy — wipe off with solvent or peel sheet format
Best for	EV battery packs, 5G RRUs >5 W/m·K target	Server power supplies, telecom where rework needed

EV battery pack guidance: For EV battery modules where the thermal gap filler India must survive 1,000+ thermal cycles and resist gravity-driven pumpout in a vertical orientation, the SDP cure-in-place format is strongly preferred. SDP-3.5 to SDP-9.5 covers the full conductivity range needed for cell-to-cooling-plate contact in cylindrical, prismatic and pouch cell formats.

FAQ

Thermal Gap Filler India — Common Engineer Questions

What conductivity of thermal gap filler India do I need for EV battery cooling?

For EV lithium-ion battery pack thermal management, most OEM designs specify 3.0–6.0 W/m·K at 1–3 mm gap thickness, achieved with SDP-3.5 to SDP-6.0 grades. High-performance BEV packs targeting aggressive fast-charging duty cycles and minimum cell temperature rise increasingly specify SDP-9.5 at 9.5 W/m·K — the highest conductivity in the Shin-Etsu gap filler India range. Pantronics India can provide grade-specific thermal impedance curves against gap thickness to help with your thermal model.

How do I apply the SDP two-component thermal gap filler India on a production line?

SDP gap fillers are dispensed using a 2K (two-component) meter-mix dispensing system with a static mixer nozzle — the two components are metered at the correct ratio and mixed inline as they are dispensed onto the battery cells or cooling plate. After dispense, the assembly is closed and passed through a conveyor oven at 60–80°C for 30–60 minutes to complete the addition-cure reaction. The cured gap filler is then a permanently bonded elastomeric layer that cannot pump out under vibration or gravity.

Can thermal gap filler India be used for 5G base station and radio unit cooling?

Yes — 5G remote radio units (RRUs) and active antenna units (AAUs) are a primary application for SDP and CLG gap fillers, where the power amplifier or baseband chip is cooled through a 1–3 mm gap to an aluminium housing. SDP-3.5 or CLG-4.8 grades typically satisfy the thermal conductivity requirement, while the gap filler’s vibration damping also helps meet 5G outdoor equipment shock and vibration specifications.

What is the shelf life of Shin-Etsu gap filler India products?

SDP two-component grades typically have a shelf life of 6–12 months when stored below 25°C away from direct sunlight; CLG pre-cured gel grades have similar storage requirements with 6–12 month shelf life depending on grade. Always check the specific grade datasheet and certificate of conformance supplied with each lot. Pantronics India manages stock rotation and can advise on minimum order quantities to align with production consumption rates.